Karsten Schneider

Title: Innovations of Karsten Schneider in Plasma Etching Technology

Introduction

Karsten Schneider is a notable inventor based in Dresden, Germany. He has made significant contributions to the field of plasma etching technology, particularly in the semiconductor industry. With a total of 2 patents, Schneider's work focuses on enhancing the efficiency and selectivity of etching processes.

Latest Patents

Schneider's latest patents include innovative methods for etching dielectric barrier layers with high selectivity. One of his patents describes a process that involves providing a substrate with a dielectric barrier layer exposed through a dielectric bulk insulating layer. The method utilizes a gas mixture containing hydrogen gas and fluorine to selectively etch the exposed portion of the dielectric barrier layer.

Another significant patent focuses on high-density plasma etching of carbon-based low-k materials in integrated circuits. This process is designed for etching a carbon-based low-k dielectric layer, specifically divinyl siloxane-benzocyclobutene (BCB). The etching gas used in this process includes oxygen, a fluorocarbon, and nitrogen, which helps achieve vertical walls in the BCB layer. The patent outlines specific conditions, such as chamber pressures and substrate temperatures, to optimize the etching rate and selectivity.

Career Highlights

Karsten Schneider is currently employed at Applied Materials, Inc., a leading company in the semiconductor equipment industry. His work at Applied Materials has allowed him to further develop and refine his innovative etching techniques.

Collaborations

Throughout his career, Schneider has collaborated with talented individuals such as Zongyu Li and Axel Walter. These collaborations have contributed to the advancement of plasma etching technologies and have fostered a productive research environment.

Conclusion

Karsten Schneider's contributions to plasma etching technology have significantly impacted the semiconductor industry. His innovative methods and collaborative efforts continue to drive advancements in this critical field.