Company Filing History:
Years Active: 1988
Title: The Innovations of Karl H. Langsdorf
Introduction
Karl H. Langsdorf is a notable inventor based in Burghausen, Germany. He has made significant contributions to the field of semiconductor technology through his innovative approaches to machining processes. His work has been recognized for its impact on the efficiency and effectiveness of wafer processing.
Latest Patents
Langsdorf holds a patent for a "Process and apparatus for abrasive machining of a wafer-like workpiece." This process is particularly designed for bilateral abrasive machining of wafer-like workpieces, especially semiconductor wafers. The innovation involves the use of carrier disks made from materials with a tensile strength of at least 100 N/mm², combined with a plastic material that has an elasticity modulus ranging from 1.0 to 8.10⁴ N/mm² in the areas that contact the workpieces.
Career Highlights
Karl H. Langsdorf is associated with Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, where he has applied his expertise in semiconductor materials and machining processes. His work has contributed to advancements in the manufacturing of electronic components, enhancing the precision and quality of semiconductor wafers.
Collaborations
Langsdorf has collaborated with notable colleagues such as Gerhard Brehm and Ingo Haller. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas in the field of electronics.
Conclusion
Karl H. Langsdorf's contributions to the field of semiconductor technology through his innovative patent and collaborative efforts highlight his importance as an inventor. His work continues to influence the industry and improve manufacturing processes.