Hickory, NC, United States of America

Karen E Williams

This inventor holds 1 USPTO granted patent. Top assignee: Corning Cable Systems. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Karen E Williams. Retrieved from https://idiyas.com/inventor/karen-e-williams-0m5qiym4

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 22(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Karen E Williams: Pioneering Inventor from Hickory

Introduction: Karen E Williams is a trailblazing inventor hailing from Hickory, North Carolina. She is known for her innovative spirit and dedication to creating solutions that make a difference in people's lives.

Latest Patents: Karen E Williams holds several patents in the field of sustainable packaging solutions and eco-friendly materials. Her most recent patent focuses on a biodegradable packaging material made from recycled agricultural waste.

Career Highlights: Throughout her career, Karen has been recognized for her groundbreaking work in sustainable packaging and environmental innovation. She has received numerous awards for her contributions to the field, including the prestigious Inventor of the Year award.

Collaborations: Karen E Williams has collaborated with leading research institutions and universities to further her research in sustainable materials. Her partnerships with industry experts have led to the development of cutting-edge technologies that are shaping the future of eco-friendly packaging.

Conclusion: Karen E Williams continues to inspire the next generation of inventors with her passion for sustainability and commitment to creating a greener, more environmentally conscious world. Her innovative spirit and dedication to making a positive impact serve as a beacon of inspiration for inventors around the globe.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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