Taoyuan, Taiwan

Kao Ping Lo

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Zerova Technologies Taiwan Limited. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kao Ping Lo. Retrieved from https://idiyas.com/inventor/kao-ping-lo-qdpjs777

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Innovations by Kao Ping Lo in Silicon Carbide Technology

Introduction

Kao Ping Lo is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of silicon carbide modules. His innovative approach has led to advancements that enhance the efficiency and performance of electronic devices.

Latest Patents

Kao Ping Lo holds a patent for a "Method for forming silicon carbide module integrated structure." This patent describes a method that includes a heat sink and a silicon carbide module, which are fixedly connected. The process involves arranging solder paste between the heat sink and the silicon carbide module, followed by a hot pressing welding process to ensure a strong bond between the two components. This innovation is crucial for improving thermal management in electronic applications.

Career Highlights

Kao Ping Lo is currently associated with Zerova Technologies Taiwan Limited, where he continues to work on cutting-edge technologies. His expertise in silicon carbide technology has positioned him as a key player in the industry, contributing to the advancement of high-performance electronic systems.

Conclusion

Kao Ping Lo's work in silicon carbide technology exemplifies the impact of innovative thinking in the field of electronics. His patent and ongoing contributions are paving the way for more efficient and reliable electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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