Kangsan Lee

Title: Kangsan Lee - Innovator in Non-Contact Gripping Technology

Introduction

Kangsan Lee is an inventor based in Suwon-si, South Korea. He is known for his innovative approaches to technology, particularly in the field of non-contact gripping mechanisms. Although he currently holds no granted patents, his contributions to the field are noteworthy.

Latest Patent Applications

Kangsan Lee has submitted several patent applications that showcase his inventive ideas. One of his latest applications is for an "APPARATUS FOR STACKING CHIP." This apparatus includes a bonding base that moves to transfer and stack a chip. It features an attachment element located at the bottom of the bonding base, which adsorbs the chip. The attachment element is designed with a cavity that allows air to flow in and out, changing the shape of the adsorbed chip. This design ensures that the chip gradually contacts the buffer, starting from the center and moving toward the edges.

Another significant application is for a "NON-CONTACT TYPE GRIPPER." This gripper includes a gripping plate with multiple blowing and suction holes, along with a cavity. The blowing holes inject gas to an object, while the suction holes are used to suck the gas back. The cavity extends from the blowing holes to minimize pressure drop, allowing for efficient gas flow. This design prevents contamination of objects, such as semiconductor chips, by gripping them in a non-contact manner.

Conclusion

Kangsan Lee's innovative ideas in non-contact gripping technology and chip stacking apparatuses highlight his potential as an inventor. His latest patent applications reflect a commitment to advancing technology in these fields.