Kang Huang

Title: Innovations by Kang Huang in Chemical Mechanical Polishing

Introduction

Kang Huang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of chemical mechanical polishing (CMP), which is crucial in semiconductor manufacturing. His innovative approaches have led to advancements that enhance the efficiency and effectiveness of substrate processing.

Latest Patents

Kang Huang holds a patent for an "Apparatus and methods for chemical mechanical polishing." This patent describes a CMP tool and methods for planarizing a substrate. The invention includes a substrate transporter designed to carry substrates among various polishers and cleaners within a CMP tool. This transporter plays a vital role in preventing substrates from drying out during transportation. By maintaining the surfaces of the substrates in a wet state during idle times, the invention helps to avoid defects such as byproducts, agglomerated abrasives, pad debris, and slurry residues. This innovation ultimately improves yields and device performance in semiconductor manufacturing.

Career Highlights

Kang Huang is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry. His work at this prestigious company has allowed him to apply his innovative ideas in a practical setting, contributing to the advancement of semiconductor technologies.

Collaborations

Kang Huang collaborates with Chih Hung Chen, a fellow professional in the field. Their partnership exemplifies the collaborative spirit that drives innovation in technology and engineering.

Conclusion

Kang Huang's contributions to chemical mechanical polishing demonstrate his commitment to innovation in the semiconductor industry. His patent and work at Taiwan Semiconductor Manufacturing Company Limited highlight the importance of advancements in substrate processing.