Gyeonggi-do, South Korea

Kang Hoon Chung


Average Co-Inventor Count = 2.4

ph-index = 1


Company Filing History:


Years Active: 2010-2017

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2 patents (USPTO):Explore Patents

Title: Kang Hoon Chung: Innovator in 3D Scanning Technology

Introduction

Kang Hoon Chung is a notable inventor based in Gyeonggi-do, South Korea. He has made significant contributions to the field of 3D scanning technology, holding two patents that showcase his innovative approach to this area.

Latest Patents

Kang Hoon Chung's latest patents include a 3D scanning apparatus and a 3D scanning method. The 3D scanning apparatus features a turntable that rotates 360 degrees around a rotating shaft, allowing for the target object to be scanned effectively. The apparatus includes a 3D scanner that captures 3D scan data of the target object while it is on the turntable. Additionally, a controller manages the operations of both the turntable and the 3D scanner, ensuring that the scanning occurs at each rotation angle and that any non-measured portions of the target object are addressed. His second patent involves a method for detecting two-dimensional sketch data from source model data for three-dimensional reverse modeling. This method outlines steps for detecting model data, establishing axes based on user input, and creating two-dimensional sketch data from the projected section data.

Career Highlights

Throughout his career, Kang Hoon Chung has worked with prominent companies in the technology sector, including 3D Systems Korea, Inc. and Inus Technology, Inc. His experience in these organizations has contributed to his expertise in 3D scanning technologies and methods.

Collaborations

Kang Hoon Chung has collaborated with notable individuals in his field, including Dong Hoon Lee and Seock Hoon Bae. These collaborations have likely enriched his work and contributed to the development of innovative solutions in 3D scanning.

Conclusion

Kang Hoon Chung is a distinguished inventor whose work in 3D scanning technology has led to significant advancements in the field. His patents reflect a commitment to innovation and a deep understanding of the technical challenges in 3D modeling.

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