Company Filing History:
Years Active: 2024
Title: Kang-Bin Mah: Innovator in Package Assembly Technology
Introduction
Kang-Bin Mah is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of package assembly technology. His innovative approach has led to the development of a unique patent that addresses heat dissipation in electronic components.
Latest Patents
Kang-Bin Mah holds a patent for a package assembly that includes a substrate, an electronic component, and a cover. This assembly design allows the electronic component to be housed within a chamber between the cover and the substrate. A cooling liquid can be filled in a heat dissipation space of the cover to effectively dissipate heat generated by the electronic component. Additionally, the cooling liquid can be introduced into the chamber where the electronic component is located, providing direct heat dissipation.
Career Highlights
Kang-Bin Mah is currently employed at Wiwynn Corporation, where he continues to innovate and develop advanced technologies. His work focuses on enhancing the efficiency and reliability of electronic packaging solutions. With a patent portfolio that includes 1 patent, he has established himself as a key player in his field.
Collaborations
Kang-Bin Mah collaborates with talented colleagues such as Yi Cheng and Wei-Ching Chang. Together, they work on various projects that aim to push the boundaries of technology in electronic packaging.
Conclusion
Kang-Bin Mah's contributions to package assembly technology highlight his innovative spirit and dedication to improving electronic component design. His work at Wiwynn Corporation and his patented inventions are paving the way for advancements in the industry.