Troy, NY, United States of America

Kamyar Pashayi


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2015-2016

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2 patents (USPTO):Explore Patents

Title: **Kamyar Pashayi: Innovating Thermal Conductance Materials**

Introduction

Kamyar Pashayi is an accomplished inventor based in Troy, NY, known for his contributions to the field of thermal interface materials. He holds two patents that highlight innovative approaches to enhancing thermal conductivity through advanced materials engineering.

Latest Patents

Pashayi's latest patents focus on "High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites." This innovative composite structure is designed to achieve high thermal conductivity while maintaining a relatively low filler loading. The unique process involves dispersing nanoparticles within a polymer matrix at low filler concentrations, followed by controlled sintering. This process promotes the agglomeration of nanoparticles, creating a connected percolating thermally conducting network within the matrix, thus optimizing thermal performance.

Career Highlights

Throughout his career, Kamyar Pashayi has worked with leading companies such as IBM and Rensselaer Polytechnic Institute. His experiences in these respected institutions have greatly contributed to his expertise in materials science and innovation.

Collaborations

Pashayi has collaborated with esteemed colleagues, including Sushumna Iruvanti and Theodorian Borca-Tasciuc. These partnerships have fostered a productive environment for research and development, allowing both Pashayi and his coworkers to push the boundaries of thermal interface technology.

Conclusion

With a strong foundation in materials engineering and a commitment to innovation, Kamyar Pashayi continues to make significant strides in the development of high-performance thermal interface materials. His work not only exemplifies the importance of collaboration in research but also aims to enhance thermal management solutions across various industries.

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