Manteca, CA, United States of America

Kambhampati Ramakrishna


Average Co-Inventor Count = 9.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 1999

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1 patent (USPTO):Explore Patents

Title: Inventor Kambhampati Ramakrishna: Innovating Semiconductor Packaging

Introduction

Kambhampati Ramakrishna is an accomplished inventor based in Manteca, California. He holds a patent that significantly contributes to the field of semiconductor technology. Ramakrishna's innovation focuses on enhancing the structural and functional aspects of semiconductor packages, aimed at improving electronic devices.

Latest Patents

Kambhampati Ramakrishna's notable patent is titled "Semiconductor package having a ground or power ring and a metal substrate." This invention presents a semiconductor package characterized by a rigid metal substrate designed with a dielectric layer that partially covers its surface. Importantly, this design allows for effective electrical bonding of the semiconductor device to specific portions of the substrate while facilitating the formation of metal circuit traces that are essential for electronic functionality. The method outlined in the patent also emphasizes the creation of vias using lasers to improve connectivity, thereby optimizing performance in electronic applications.

Career Highlights

Kambhampati Ramakrishna has made a mark in the technology sector through his work with Olin Corporation. His dedication to research and development has resulted not only in his patent but also in advancements that enhance semiconductor manufacturing processes. His technical expertise and innovative approaches continue to pave the way for improvements in various electronic applications.

Collaborations

Throughout his career, Ramakrishna has collaborated with esteemed colleagues, including Salvador A. Tostado and George A. Brathwaite. These partnerships have enabled the sharing of ideas and expertise that drive innovation in their field, contributing to more effective solutions in semiconductor technology.

Conclusion

Kambhampati Ramakrishna stands out as a pioneer in semiconductor packaging, with a commitment to innovation reflected in his patented work. His contributions not only advance the capabilities of electronic devices but also highlight the importance of collaboration in achieving significant technological advancements. As he continues his journey, the impact of his inventions will likely resonate throughout the industry for years to come.

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