Tuscaloosa, AL, United States of America

Kamaram Munira

This inventor holds 3 USPTO granted patents. Top assignees: The University of Alabama, Samsung Electronics Co., Ltd.. Active years: 2017-2019.


% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 2

Forward Citations = 18(Granted Patents)


Company Filing History:


Years Active: 2017-2019

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3 patents (USPTO):Explore Patents

Title: Kamaram Munira: Innovator in Layered Heusler Alloys

Introduction

Kamaram Munira is a notable inventor based in Tuscaloosa, AL (US). He has made significant contributions to the field of materials science, particularly in the development of layered Heusler alloys. With a total of 3 patents to his name, Munira's work has implications for various applications in technology and engineering.

Latest Patents

Munira's latest patents focus on layered Heusler alloys and methods for their fabrication and use. These alloys consist of a first layer made from a Heusler alloy with a face-centered cubic (fcc) crystal structure, and a second layer made from a different Heusler alloy with the same fcc structure. The innovative aspect of these patents lies in the layering direction, which can be along the [110] or [111] direction of the fcc crystal structure. This unique configuration enhances the properties of the alloys, making them suitable for advanced applications.

Career Highlights

Throughout his career, Kamaram Munira has worked with prestigious organizations, including the University of Alabama and Samsung Electronics Co., Ltd. His experience in these institutions has allowed him to collaborate on various research projects and contribute to the advancement of materials science.

Collaborations

Some of Munira's notable coworkers include William Hill Butler and Javad Ghasemi Azadani. Their collaborative efforts have further enriched the research landscape in which Munira operates.

Conclusion

Kamaram Munira's innovative work in layered Heusler alloys showcases his expertise and dedication to advancing materials science. His contributions are expected to have a lasting impact on technology and engineering fields.

Profile summary based on public USPTO records.
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