Hong Kong, China

Kam Po Wong

This inventor holds 1 USPTO granted patent. Top assignee: The Hong Kong Polytechnic University. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kam Po Wong. Retrieved from https://idiyas.com/inventor/kam-po-wong

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Kam Po Wong - Innovator in Nickel Electroforming

Introduction

Kam Po Wong is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of electroforming, particularly through his innovative processes. With a focus on improving surface finishes in nickel electroforms, Wong's work has garnered attention in the scientific community.

Latest Patents

Wong holds a patent for a "Process for making nickel electroforms." This invention is characterized by the application of pulse current during the electrodeposition of nickel. The unique aspect of his process involves pulse current waveforms that feature ramp-down spikes, which lead to enhancements in the surface finishes of electroforms created by this method. He has 1 patent to his name.

Career Highlights

Kam Po Wong is affiliated with The Hong Kong Polytechnic University, where he continues to engage in research and development. His work at the university allows him to explore innovative solutions in electroforming and related technologies.

Collaborations

Wong has collaborated with esteemed colleagues such as Tai Man Yue and Kang Cheung Chan. These partnerships have contributed to the advancement of their shared research interests and have fostered a collaborative environment for innovation.

Conclusion

Kam Po Wong's contributions to the field of nickel electroforming exemplify the impact of innovative processes in technology. His patent and ongoing work at The Hong Kong Polytechnic University highlight his commitment to advancing the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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