Tampere, Finland

Kaisa P Putkisto


 

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Kaisa P Putkisto: Innovator in Composite Packaging Solutions

Introduction

Kaisa P Putkisto is a notable inventor based in Tampere, Finland. She has made significant contributions to the field of packaging technology, particularly through her innovative designs and solutions. Her work focuses on creating efficient and sustainable packaging options that meet the needs of modern consumers and industries.

Latest Patents

Kaisa holds a patent for a unique invention titled "Tray Composite and Package." This patent describes a tray composite that includes a polymeric-based liner with an exterior surface layer, an interior surface layer, and a fiber-based component that is removably affixed to the interior surface layer. A release agent is strategically placed between the polymeric-based liner and the fiber-based component, allowing for manual separation after they have been affixed together. This innovation enhances the functionality and usability of packaging solutions.

Career Highlights

Kaisa is currently employed at Amcor Flexibles North America, Inc., where she continues to develop and refine packaging technologies. Her role involves collaborating with a team of experts to create innovative solutions that address the challenges faced by the packaging industry. Kaisa's dedication to her work has positioned her as a key player in the field.

Collaborations

Kaisa collaborates closely with her coworker, Hanna-Mari Lahti, who also contributes to the development of innovative packaging solutions. Their teamwork exemplifies the importance of collaboration in driving innovation and achieving successful outcomes in their projects.

Conclusion

Kaisa P Putkisto is a pioneering inventor whose work in composite packaging solutions is making a significant impact in the industry. Her innovative approach and dedication to sustainability are paving the way for future advancements in packaging technology.

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