Shanghai, China

Kaichun Wang

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Intradin (Shanghai) Machinery Co., Ltd.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kaichun Wang. Retrieved from https://idiyas.com/inventor/kaichun-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: The Innovations of Kaichun Wang

Introduction

Kaichun Wang is an accomplished inventor based in Shanghai, China. He has made significant contributions to the field of machinery with his innovative designs and patents. His work reflects a commitment to enhancing efficiency and functionality in industrial applications.

Latest Patents

Kaichun Wang holds a patent for an Electric Sausage Filler. This invention showcases his ability to combine technology with practical applications in food processing. The patent highlights his innovative approach to improving traditional methods.

Career Highlights

Wang is currently employed at Intradin (Shanghai) Machinery Co., Ltd. His role at the company allows him to apply his inventive skills in a professional setting. His contributions have been instrumental in advancing the company's product offerings.

Collaborations

Kaichun Wang has worked alongside talented colleagues, including Junliang Wang and Xiaobo Xu. Their collaborative efforts have fostered a creative environment that encourages innovation and the development of new ideas.

Conclusion

Kaichun Wang's work exemplifies the spirit of innovation in the machinery industry. His patent for the Electric Sausage Filler is a testament to his inventive capabilities. Wang's contributions continue to influence the field and inspire future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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