This inventor holds 2 USPTO granted patents and 3 published patent applications. Top assignee: Benq Materials Corporation. Active years: 2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023
Title: Innovations of Kai-Wei Cheng
Introduction
Kai-Wei Cheng is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of separators used in various applications. With a total of 2 patents to his name, Cheng continues to push the boundaries of innovation.
Latest Patents
Cheng's latest patents include a method for manufacturing a separator. This method involves providing a nonporous precursor substrate and coating it with a heat-resistant slurry to form a heat-resistant coating layer. The process includes stretching the substrate to generate a separator that comprises a porous substrate and a heat-resistant layer. The heat-resistant layer is strategically disposed on the surface of the porous substrate, covering between 10% to 90% of its total surface area. Another patent focuses on the separator itself, which consists of a porous substrate and a heat-resistant layer made from a binder and inorganic particles.
Career Highlights
Cheng is currently employed at Benq Materials Corporation, where he applies his expertise in materials science to develop innovative solutions. His work has been instrumental in advancing the technology behind separators, which are crucial for various industrial applications.
Collaborations
Cheng collaborates with talented coworkers such as Wei-Ting Yeh and Yi-Fang Huang. Their combined efforts contribute to the innovative projects at Benq Materials Corporation.
Conclusion
Kai-Wei Cheng is a prominent inventor whose work in the field of materials science has led to significant advancements in separator technology. His contributions continue to influence the industry and inspire future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
