This inventor holds 1 USPTO granted patent. Top assignee: Benq Materials Corporation. Active years: 2015.
Company Filing History:
Years Active: 2015
Title: Innovations of Kai-Hsuan Chang
Introduction
Kai-Hsuan Chang is a notable inventor based in Chiayi, Taiwan. He has made significant contributions to the field of adhesive compositions, particularly for electrical applications. His work is characterized by a focus on enhancing the performance and reliability of adhesive materials.
Latest Patents
One of his key patents is an adhesive composition designed for conduction between electrical elements. This invention comprises 25 to 46 parts by weight of nitrile-butadiene rubber with a Mooney viscosity ranging from 50 to 75 (ML 1+4@100)° C. It also includes 25 to 45 parts by weight of acrylic oligomer, 16 to 32 parts by weight of thermoplastic resin, two organic peroxides with differing one-minute half-life temperatures, and a coupling agent. The thermoplastic resin is selected from a group that includes phenoxy resin, poly(methyl)methacrylate copolymer, polystyrene copolymer, and Novolak resin. This innovative adhesive composition is crucial for improving the efficiency of electrical connections.
Career Highlights
Kai-Hsuan Chang is currently associated with Benq Materials Corporation, where he continues to develop advanced materials for various applications. His expertise in adhesive technology has positioned him as a valuable asset in the industry.
Collaborations
He has collaborated with notable colleagues such as Tsung-Ju Hsu and Yu-Chen Yeh, contributing to the advancement of adhesive technologies.
Conclusion
Kai-Hsuan Chang's innovative work in adhesive compositions showcases his commitment to enhancing electrical connectivity. His contributions are vital for the ongoing development of reliable materials in the electronics industry.