Hong Kong, China

Kai Ding

This inventor holds 1 USPTO granted patent. Top assignee: The Hong Kong Polytechnic University. Active years: 2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kai Ding. Retrieved from https://idiyas.com/inventor/kai-ding-pb62ygm1

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: Innovations of Inventor Kai Ding

Introduction

Kai Ding is an accomplished inventor based in Hong Kong, CN. He has made significant contributions to the field of magnetic materials, particularly through his innovative patent. His work focuses on enhancing the performance of magnetic compositions used in power conversion applications.

Latest Patents

One of Kai Ding's notable patents is for polymer-bonded magnetic materials. This invention includes a magnetic composition that combines a thermoplastic polymer with magnetic powders. The resulting composition boasts a tensile strength of greater than 20 N/mm, making it suitable for various industrial applications.

Career Highlights

Kai Ding is affiliated with The Hong Kong Polytechnic University, where he continues to advance research in materials science. His expertise in magnetic materials has positioned him as a key figure in the academic and research community.

Collaborations

Kai Ding collaborates with esteemed colleagues, including Ka Wai Eric Cheng and Yuen Wah Wong. Their combined efforts contribute to the ongoing research and development in the field of magnetic materials.

Conclusion

Kai Ding's innovative work in polymer-bonded magnetic materials exemplifies the impact of research on practical applications. His contributions continue to influence advancements in power conversion technologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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