Bonndorf, Germany

Kai Brombach

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Syntegon Packaging Systems Ag. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kai Brombach. Retrieved from https://idiyas.com/inventor/kai-brombach

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: The Innovations of Kai Brombach

Introduction

Kai Brombach is a notable inventor based in Bonndorf, Germany. He has made significant contributions to the field of packaging technology. His innovative designs focus on enhancing the efficiency and effectiveness of packaging processes.

Latest Patents

Brombach holds a patent for a horizontal forming device. This device is particularly designed for horizontal flow pack machines. It features a roller-free forming unit that is capable of shaping a packaging material web, specifically a paper web, into a packaging material tube. The forming unit includes a folding edge around which the packaging material web can be deflected. Additionally, it comprises a form-guiding unit that ensures the packaging material tube is guided transversely while maintaining a homogeneous material tension.

Career Highlights

Kai Brombach is currently employed at Syntegon Packaging Systems AG. His work focuses on developing advanced packaging solutions that meet the demands of modern manufacturing. With a patent portfolio that includes 1 patent, he continues to push the boundaries of packaging technology.

Collaborations

Brombach has collaborated with notable colleagues such as Michael Lopes and Maurizio Maj. Their combined expertise contributes to the innovative projects at Syntegon Packaging Systems AG.

Conclusion

Kai Brombach's contributions to packaging technology exemplify the spirit of innovation. His work not only enhances packaging processes but also sets a standard for future developments in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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