Company Filing History:
Years Active: 2017-2018
Title: Innovations by Inventor Kai-Bin Wu
Introduction
Kai-Bin Wu is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on advanced semiconductor package assemblies, which are crucial for modern electronic devices.
Latest Patents
One of his latest patents is a semiconductor package assembly with through silicon via (TSV) interconnect. This invention provides a semiconductor package assembly that includes a first semiconductor package mounted on a base. The first semiconductor package consists of a semiconductor die, a semiconductor substrate, and both a first and a second array of TSV interconnects formed through the semiconductor substrate. These arrays are separated by an interval region. Additionally, a second semiconductor die is mounted on the first semiconductor package, featuring a ground pad. One of the TSV interconnects of the first semiconductor package connects the ground pad of the second semiconductor die to an interconnection structure on the front side of the semiconductor substrate.
Another patent by Kai-Bin Wu also focuses on a semiconductor package assembly with TSV interconnect. This invention includes a first semiconductor die mounted on a base, which contains a semiconductor substrate. Similar to his previous patent, it features a first and a second array of TSV interconnects formed through the semiconductor substrate, separated by an interval region. A first ground TSV interconnect is located within this interval region, connecting the ground pad of the second semiconductor die to an interconnection structure on the front side of the semiconductor substrate.
Career Highlights
Kai-Bin Wu is currently employed at MediaTek Corporation, a leading global semiconductor company. His work at MediaTek has allowed him to contribute to cutting-edge technologies in the semiconductor industry.
Collaborations
Throughout his career, Kai-Bin Wu has collaborated with several talented individuals, including Ming-Tzong Yang and Cheng-Chou Hung. These collaborations have further enhanced his innovative capabilities and contributions to the field.
Conclusion
Kai-Bin Wu is a distinguished inventor whose work in semiconductor technology has led to significant advancements in the industry. His patents reflect his commitment to innovation and excellence in the field of electronics.