Stockholm, Sweden

Jörgen Eriksson

This inventor holds 1 USPTO granted patent. Top assignee: Packetfront Sweden Ab. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jörgen Eriksson. Retrieved from https://idiyas.com/inventor/jörgen-eriksson

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Jörgen Eriksson: Innovator in Heat Dissipation Technology

Introduction

Jörgen Eriksson is a notable inventor based in Stockholm, Sweden. He has made significant contributions to the field of electronic circuit housing, particularly focusing on innovative designs that enhance heat dissipation.

Latest Patents

One of Eriksson's key inventions is a patent for a fan-less housing designed for electronic circuits and components. This innovative housing features an assembly of two container parts that comprise heat-sink fins. Each part has a substantially diagonal shaped profile, allowing for improved cooling efficiency. The circuit board is mounted along this diagonal profile, ensuring that the long-side ends of the board are covered by a greater mass of heat-sink fins compared to a horizontally mounted circuit board. This design significantly enhances the cooling of electronic components.

Career Highlights

Jörgen Eriksson is currently associated with Packetfront Sweden AB, where he continues to develop and refine his innovative ideas. His work has been instrumental in advancing technologies that address the challenges of heat management in electronic devices.

Collaborations

Eriksson collaborates with talented individuals such as Anders Elo and Niclas Sonesson, contributing to a dynamic work environment that fosters innovation.

Conclusion

Jörgen Eriksson's contributions to the field of electronic housing design exemplify the importance of innovation in technology. His patented fan-less housing represents a significant advancement in heat dissipation solutions for electronic circuits.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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