Oakton, VA, United States of America

Jyh-Ming Lien

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignees: George Mason University, Seoul National University. Active years: 2023.

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Innovations by Jyh-Ming Lien

Introduction

Jyh-Ming Lien is an accomplished inventor based in Oakton, VA (US). He has made significant contributions to the field of electronic apparatuses, particularly in the context of three-dimensional (3D) structures. His innovative approach has led to the development of a unique method for manufacturing electronic devices that can be seamlessly attached to curved surfaces.

Latest Patents

Jyh-Ming Lien holds 1 patent for his invention titled "Electronic apparatus attachable to surface of 3D structure having curved surface and method of manufacturing the same." This patent outlines a method that includes approximating the surface of a 3D structure with two-dimensional (2D) meshes. The process involves forming a developed view by developing the 2D meshes, manufacturing an electronic apparatus that mirrors the shape of the developed view, and ultimately attaching the apparatus to the surface of the 3D structure.

Career Highlights

Throughout his career, Jyh-Ming Lien has worked with prestigious institutions such as Seoul National University and George Mason University. His experience in these academic environments has allowed him to refine his skills and contribute to groundbreaking research in electronic apparatus design.

Collaborations

Jyh-Ming Lien has collaborated with notable colleagues, including In Suk Choi and Yu Ki Lee. These partnerships have fostered a creative environment that encourages innovation and the exchange of ideas.

Conclusion

Jyh-Ming Lien's work exemplifies the intersection of creativity and technology in the field of electronic apparatuses. His innovative methods and collaborations continue to influence advancements in the manufacturing of devices for complex 3D structures.

Profile summary based on public USPTO records.
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