West Lafayette, IN, United States of America

Justin Weibel

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Pc Krause and Associates, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Justin Weibel. Retrieved from https://idiyas.com/inventor/justin-weibel

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Justin Weibel and Power Module Thermal Management

Introduction

Justin Weibel is an inventor based in West Lafayette, Indiana. His work includes a patented thermal management system designed to cool semiconductor components and their supporting baseplate.

Latest Patents

Weibel is associated with 1 patent, titled “Power Module Thermal Management System.” The invention combines a baseplate assembly, including a baseplate and semiconductor die, with a fluid flow system. One flow path uses submerged jet impingement to direct fluid onto the semiconductor die, while a second path carries fluid in thermal contact with the baseplate. Together, the paths transfer heat away from both components to cool the assembly.

Career Highlights

Weibel is associated with PC Krause and Associates, Inc. His patent focuses on thermal management for power modules, addressing heat removal from both a semiconductor die and its baseplate.

Collaborations

Jason Wells and Nicholas Benavides are identified as Weibel’s coworkers. The available information does not specify their roles in the patent or the invention.

Conclusion

Justin Weibel’s patented system uses two fluid flow paths to cool a semiconductor die and its baseplate, highlighting his contribution to power module thermal management.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…