Mesa, AZ, United States of America

Justin Schnepf

This inventor holds 1 USPTO granted patent. Top assignee: Honeywell International Inc.. Active years: 2020.


Average Co-Inventor Count = 10.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Innovations by Justin Schnepf in Additive Manufacturing

Introduction

Justin Schnepf is an accomplished inventor based in Mesa, AZ (US). He has made significant contributions to the field of additive manufacturing through his innovative patent. His work focuses on enhancing the evaluation of powder spreadability, which is crucial for the success of additive manufacturing processes.

Latest Patents

Justin holds a patent for "Devices and methods for evaluating the spreadability of powders utilized in additive manufacturing." This patent introduces devices, referred to as powder spreadability inspection tools, and methods designed to assess the spreadability of powders used in additive manufacturing. The inspection tool features a powder support surface with a visual inspection area, a spreader system, and a powder dispenser. The spreader implement moves along a designated path over the visual inspection area, allowing for a thorough evaluation of the powder's spreadability.

Career Highlights

Justin is currently employed at Honeywell International Inc., where he applies his expertise in additive manufacturing. His innovative approach to evaluating powder spreadability has the potential to improve the quality and efficiency of additive manufacturing processes.

Collaborations

Justin collaborates with talented coworkers, including Ethanial Harms and Brian G Baughman, who contribute to the advancement of technology in their field.

Conclusion

Justin Schnepf's contributions to the field of additive manufacturing through his innovative patent demonstrate his commitment to enhancing industry standards. His work is paving the way for more efficient and effective manufacturing processes.

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