Company Filing History:
Years Active: 2020-2022
Title: The Innovative Contributions of Justin Houck
Introduction
Justin Houck is a notable inventor based in Marietta, GA (US). He has made significant contributions to the field of packaging technology, particularly through his innovative designs and methods. With a total of 3 patents to his name, Houck continues to push the boundaries of what is possible in his industry.
Latest Patents
Houck's latest patents include advancements in microwaved multi-ply structures, microwaved packages, and methods of sterilization. These multi-ply structures consist of a barrier film that includes a first polyester layer and a silicon oxide layer, along with a first adhesive layer and a sealant film. The first adhesive layer is strategically placed between the barrier film and the sealant film. Notably, these multi-ply structures have been microwaved in a pressurized vessel, enhancing their functionality. The packages formed from these structures are also designed to be microwaved in a pressurized environment, showcasing Houck's innovative approach to packaging solutions.
Career Highlights
Justin Houck is currently employed at Printpack Illinois, Inc., where he applies his expertise in packaging technology. His work has garnered attention for its practical applications and innovative designs. His contributions have not only advanced the field but have also provided new solutions for various packaging needs.
Collaborations
Throughout his career, Houck has collaborated with talented individuals such as Nilesh Savargaonkar and James Mitchell Ray. These collaborations have further enriched his work and contributed to the success of his projects.
Conclusion
Justin Houck's innovative spirit and dedication to advancing packaging technology are evident in his patents and career achievements. His work continues to influence the industry and pave the way for future innovations.