The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2021
Filed:
Jun. 30, 2017
Applicant:
Printpack Illinois, Inc., Elgin, IL (US);
Inventors:
Justin Houck, Marietta, GA (US);
James Ray, Marietta, GA (US);
Nilesh Savargaonkar, Marietta, GA (US);
Assignee:
PRINTPACK ILLINOIS, INC., Elgin, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/18 (2006.01); B32B 7/02 (2019.01); B32B 7/06 (2019.01); B32B 7/12 (2006.01); B32B 27/16 (2006.01); B32B 27/28 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01);
U.S. Cl.
CPC ...
B32B 27/18 (2013.01); B32B 7/02 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 27/16 (2013.01); B32B 27/28 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 2250/04 (2013.01); B32B 2250/05 (2013.01); B32B 2255/10 (2013.01); B32B 2264/00 (2013.01); B32B 2264/102 (2013.01); B32B 2307/546 (2013.01); B32B 2307/7145 (2013.01); B32B 2307/7242 (2013.01); B32B 2307/7244 (2013.01); B32B 2307/7246 (2013.01); B32B 2307/75 (2013.01); B32B 2439/40 (2013.01); B32B 2439/70 (2013.01); B32B 2439/80 (2013.01);
Abstract
Multi-ply structures are provided that include a barrier film, which has a first polyester layer and a silicon oxide layer, a first adhesive layer, and a sealant film, where the first adhesive layer is located between the barrier film and the sealant film, and where the multi-ply structure has been microwaved in a pressurized vessel. Packages that are formed from the multi-ply structures are also provided in which these packages are microwaved in a pressurized vessel. Methods for sterilization are also provided.