Justin Everman

Title: Justin Everman: Innovator in Die Alignment Technology

Introduction

Justin Everman is a notable inventor based in Richardson, TX (US). He has made significant contributions to the field of semiconductor technology, particularly in die alignment systems. His innovative approach has led to the development of a unique patent that enhances the efficiency of semiconductor packaging.

Latest Patents

Justin Everman holds a patent for "Stud bumps for die alignment." This invention includes apparatuses and systems featuring a package with stud bumps designed for die alignment. The package comprises a substrate and multiple stud bumps that are coupled to the substrate. These stud bumps define a die region where the movement of a die is restricted before it is attached to the substrate. The design ensures that the profile of the stud bumps is less than that of the die when it is affixed to the package substrate. This innovation aims to improve the reliability and precision of semiconductor devices.

Career Highlights

Justin is currently employed at Triquint Semiconductor Corporation, where he applies his expertise in semiconductor technology. His work focuses on enhancing the performance and reliability of semiconductor packages. With a strong foundation in engineering and innovation, he continues to push the boundaries of technology in his field.

Collaborations

Throughout his career, Justin has collaborated with talented professionals, including Bruno Samuel and Charles E Carpenter. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Justin Everman is a distinguished inventor whose work in die alignment technology has made a significant impact in the semiconductor industry. His patent for stud bumps exemplifies his innovative spirit and commitment to advancing technology.