The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2011
Filed:
Aug. 07, 2009
Bruno Samuel, Apopka, FL (US);
Charles Carpenter, Orlando, FL (US);
John Beall, Richardson, TX (US);
Justin Everman, Richardson, TX (US);
Benne Velsher, Plano, TX (US);
Bruno Samuel, Apopka, FL (US);
Charles Carpenter, Orlando, FL (US);
John Beall, Richardson, TX (US);
Justin Everman, Richardson, TX (US);
Benne Velsher, Plano, TX (US);
TriQuint Semiconductor, Inc., Hillsboro, OR (US);
Abstract
Embodiments include but are not limited to apparatuses and systems including a package having stud bumps for die alignment. A package may include a package substrate, and a plurality of stud bumps coupled to the package substrate. The stud bumps may define a die region of the package substrate in which movement of a die disposed within the die region is restricted prior to attachment of the die to the package substrate, wherein the plurality of stud bumps comprise a profile that is less than a profile of the die when attached to the package substrate. Other embodiments may be described.