Company Filing History:
Years Active: 2011
Title: The Innovations of Bruno Samuel
Introduction
Bruno Samuel is an accomplished inventor based in Apopka, Florida. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique patent that addresses die alignment in packaging.
Latest Patents
Bruno Samuel holds a patent for "Stud bumps for die alignment." This invention includes apparatuses and systems featuring a package with stud bumps designed for die alignment. The package consists of a substrate and multiple stud bumps that are coupled to the substrate. These stud bumps define a die region where the movement of a die is restricted before it is attached to the substrate. Notably, the profile of the stud bumps is less than that of the die when it is affixed to the package substrate. This innovation enhances the reliability and efficiency of semiconductor packaging.
Career Highlights
Bruno Samuel is currently employed at Triquint Semiconductor Corporation, where he continues to push the boundaries of technology. His work at the company has been instrumental in advancing semiconductor solutions. He has demonstrated a strong commitment to innovation throughout his career.
Collaborations
Bruno has collaborated with notable colleagues, including Charles E Carpenter and John Beall. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Bruno Samuel's contributions to the field of semiconductor technology exemplify the spirit of innovation. His patent for stud bumps for die alignment showcases his ability to solve complex problems in the industry. Through his work at Triquint Semiconductor Corporation, he continues to make a lasting impact on technology.