Jurgen Hornung

Title: Jurgen Hornung: Innovator in Solder Technology

Introduction

Jurgen Hornung is a notable inventor based in Grundau, Germany. He has made significant contributions to the field of solder technology, holding 2 patents that showcase his innovative approach to materials and applications.

Latest Patents

One of his latest patents is focused on solder pastes comprising nonresinous fluxes. This invention presents a resin-free solder paste made from a metal powder, particularly soft solder, and a gel. The gel is designed to leave no residue on the metal surface during the remelting of the metal powder. It is based on a stable mixture that includes carboxylic acid(s), amine(s), and solvent(s). This innovation is particularly useful in applications such as power-modules, die-attach, chip-on-board, and wafer-bumping, especially on Under-Bump-Metallization (UBM) and Surface Mounted Technology (SMT). The use of these resin-free soft solder pastes eliminates the need for cleaning before protective coating processes, significantly reducing the formation of pores in solder bumps.

Another significant patent by Hornung is for a composite substrate for printed circuits. This invention allows for the firing of a composite carrier for a printed circuit, which has a base of metal, typically steel, making it highly resistant to vibration and bending. The coating or cover layer consists of a glass ceramic made from BaO-Al2O3-SiO2, with specific percentages of each component to ensure optimal performance. The glass ceramic can be dyed and is compatible with standard resistor and conductor pastes, suitable for firing temperatures above 850°C.

Career Highlights

Jurgen Hornung is associated with W.C. Heraeus GmbH, a company known for its advancements in materials technology. His work has significantly impacted the industry, particularly in the development of innovative solder materials.

Collaborations

Throughout his career, Hornung has collaborated with notable colleagues, including Karl Deckelmann and Graham S. Jones. These partnerships have contributed to the advancement of his inventions and the overall progress in solder technology.

Conclusion

Jurgen Hornung's contributions to solder technology through his innovative patents demonstrate his expertise and commitment to advancing the field. His work continues to influence various applications in electronics and materials science.