Chengdu, China

Junyang Liu

This inventor holds 1 USPTO granted patent. Top assignee: University of Electronic Science and Technology of China. Active years: 2026.


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Innovations of Junyang Liu in 3D Scanning Technology.

Introduction

Junyang Liu is a prominent inventor based in Chengdu, China. He has made significant contributions to the field of robotics and 3D scanning technology. His innovative approach focuses on enhancing measurement efficiency and safety through advanced methodologies.

Latest Patents

Junyang Liu holds a patent titled "Method for robot assisted multi-view 3D scanning measurement based on path planning." This invention provides a comprehensive method for conducting 3D scanning measurements using robots. The process begins with establishing a virtual simulation platform to set measurement poses and paths, which improves measurement efficiency and ensures safety. The invention also includes a preliminary hand-eye calibration that reduces system noise and optimizes accuracy through a particle swarm optimization algorithm. Ultimately, the method allows for the transformation of single-view point clouds into a complete 3D representation of the measured object.

Career Highlights

Junyang Liu is affiliated with the University of Electronic Science and Technology of China. His work at the university has allowed him to explore and develop innovative solutions in the realm of robotics and measurement technologies. His dedication to research and development has positioned him as a key figure in his field.

Collaborations

Junyang Liu has collaborated with notable colleagues such as Chun Yin and Yan Gao. Their combined expertise has contributed to advancements in their research projects and innovations.

Conclusion

Junyang Liu's contributions to 3D scanning technology exemplify the impact of innovative thinking in robotics. His patent reflects a commitment to improving measurement processes, showcasing the potential for future advancements in this field.

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