Junya Komano

Title: Junya Komano: Innovator in Molding Packaging Materials

Introduction

Junya Komano is a notable inventor based in Takaoka, Japan. He has made significant contributions to the field of packaging materials, particularly through his innovative patent that addresses the challenges of interlaminar strength in molding packaging materials.

Latest Patents

Junya Komano holds a patent for a molding packaging material and method for producing the same. This invention provides a molding packaging material that excels in interlaminar lamination strength. It effectively prevents deterioration of the interlaminar strength due to the influences of electrolytes, as well as heat generation and expansion or contraction caused by the charging and discharging cycles. The innovative design includes a heat-resistant resin layer as the outer layer, a polypropylene layer as the inner layer, and a metal foil layer arranged between them. The inner side surface of the metal foil layer undergoes a chemical conversion treatment, allowing for enhanced adhesion with the polypropylene layer through an adhesive layer.

Career Highlights

Throughout his career, Junya Komano has worked with prominent companies in the packaging industry. He has been associated with Showa Denko Packaging Co., Ltd. and Toagosei Company, Ltd. His work in these organizations has contributed to advancements in packaging technology.

Collaborations

Junya Komano has collaborated with notable colleagues, including Takahiro Ito and Makoto Imahori. Their combined expertise has likely fostered innovative solutions in their respective fields.

Conclusion

Junya Komano's contributions to the field of molding packaging materials demonstrate his commitment to innovation and excellence. His patent reflects a deep understanding of material science and engineering, paving the way for advancements in packaging technology.