Shenzhen, China

Junwei Yang

This inventor holds 1 USPTO granted patent. Top assignee: Black Sesame Technologies Inc.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Junwei Yang. Retrieved from https://idiyas.com/inventor/junwei-yang-nei3zbuj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Junwei Yang - Innovator in System-on-Chip Verification

Introduction

Junwei Yang is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of system-on-chip (SoC) verification. His innovative approach has led to the development of a patented method that enhances the verification process for SoCs.

Latest Patents

Junwei Yang holds a patent titled "Method, system and verifying platform for system on chip verification." This patent outlines a comprehensive method for SoC verification, which includes establishing a component library, creating a control file based on verification requirements, and generating a verification platform to ensure the reliability of SoCs. The method is designed to streamline the verification process and improve efficiency in the development of SoC technologies.

Career Highlights

Junwei Yang is currently employed at Black Sesame Technologies Inc., where he continues to work on advancing SoC verification methodologies. His expertise in this area has positioned him as a valuable asset to his company and the broader technology community.

Collaborations

He collaborates with notable colleagues such as Wei Cai and Maosheng Xue, contributing to innovative projects and research in the field of semiconductor technology.

Conclusion

Junwei Yang's contributions to SoC verification through his patented methods demonstrate his commitment to innovation in technology. His work not only enhances the verification process but also sets a standard for future developments in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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