Harbin, China

Junran Feng

This inventor holds 1 USPTO granted patent. Top assignee: Institute of Food Processing, Haas. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Junran Feng. Retrieved from https://idiyas.com/inventor/junran-feng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Junran Feng and Microwave-Induced Cracking for Easy-to-Cook Whole Grains.

Introduction

Junran Feng is an inventor associated with food-processing research in Harbin, China. His work includes a method designed to make whole grains easier to cook while preserving their overall shape.

Latest Patents

Feng is associated with 1 patent: “Preparation Method of Easy-to-Cook Whole Grain Based on Microwave-Induced Cracking.” The invention belongs to the field of food processing. It treats whole grains with heat and moisture, followed by short-time microwave-induced cracking, tempering, and cooling.

The resulting grains remain intact, expand slightly, and develop fine surface cracks. During steaming, their water absorption increases from 1.35 times to 1.9 times the original weight compared with unprocessed whole grains.

Career Highlights

Feng is associated with the Institute of Food Processing, Haas. His patent focuses on improving the cooking properties of whole grains through a sequence of processing steps.

Collaborations

Feng’s listed coworkers include Shuwen Lu and Chuanying Ren.

Conclusion

Junran Feng’s patent describes a microwave-based approach to preparing whole grains that absorb more water during steaming while retaining their shape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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