Tokyo, Japan

Junpei Oomura

USPTO Granted Patents = 7 

 

Average Co-Inventor Count = 4.2

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2016-2019

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7 patents (USPTO):Explore Patents

Title: Junpei Oomura: Innovator in Thermal Transfer Technology

Introduction

Junpei Oomura is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of thermal transfer technology, holding a total of seven patents. His innovative work has advanced the capabilities of thermal transfer sheets, making them more efficient and effective for various applications.

Latest Patents

One of Oomura's latest patents is for a sublimation type thermal transfer sheet. This invention features a substrate with first, second, and third dye layers arranged sequentially on one surface, along with a back-face layer on the opposite side. Each dye layer contains individual sublimable dyes and binder resins, enhancing the transfer process. Additionally, one of the dye layers includes a releasing agent from a specific group, while the third dye layer is designed to minimize the use of releasing agents. Another notable patent involves a method for forming prints and peeling off transfer layers, which allows for precise removal of regions from the transfer layer, ensuring high-quality prints on transfer receiving articles.

Career Highlights

Oomura has worked with notable companies in the industry, including Dai Nippon Printing Co., Ltd. and Mitsui Chemicals Tohcello, Inc. His experience in these organizations has contributed to his expertise in thermal transfer technologies and has facilitated his innovative endeavors.

Collaborations

Throughout his career, Oomura has collaborated with talented individuals such as Shinya Yoda and Kenzo Hayashi. These partnerships have likely fostered a creative environment that has led to the development of his groundbreaking inventions.

Conclusion

Junpei Oomura's contributions to thermal transfer technology exemplify his innovative spirit and dedication to advancing the field. His patents and collaborations reflect a commitment to excellence and a drive to improve the efficiency of thermal transfer processes.

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