Hoboken, NJ, United States of America

Junjun Ding


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Innovations of Junjun Ding in Stretchable Supercapacitors

Introduction

Junjun Ding is an accomplished inventor based in Hoboken, NJ (US). He has made significant contributions to the field of flexible electronics, particularly in the development of stretchable supercapacitors. His innovative work has the potential to revolutionize energy storage solutions in wearable technology and other applications.

Latest Patents

Junjun Ding holds 1 patent for his invention titled "Stretchable supercapacitors with vertically-aligned embedded carbon nanotubes." This patent describes a method for creating flexible and stretchable supercapacitors using carbon nanostructures. The process involves a first composite structure that includes a temporary substrate and an array of carbon nanotubes arranged in a stack, oriented generally perpendicular to the surface of the temporary substrate. The stack of carbon nanotubes is then transferred to another substrate, which includes a curable polymer, forming a composite structure that integrates the carbon nanotubes with the cured polymer.

Career Highlights

Junjun Ding is affiliated with the Stevens Institute of Technology, where he continues to advance research in the field of materials science and engineering. His work focuses on the integration of nanotechnology into practical applications, enhancing the performance and versatility of energy storage devices.

Collaborations

Junjun has collaborated with notable colleagues, including Runzhi Zhang and Eui-Hyeok Yang, Jr. Their combined expertise contributes to the innovative research environment at Stevens Institute of Technology.

Conclusion

Junjun Ding's contributions to the field of stretchable supercapacitors exemplify the intersection of innovation and practical application in energy storage technology. His work not only advances scientific understanding but also paves the way for future developments in flexible electronics.

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