Taiyuan, China

Junjie Guo

This inventor holds 1 USPTO granted patent. Top assignee: Taiyuan University of Technology. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Junjie Guo. Retrieved from https://idiyas.com/inventor/junjie-guo-r9u9fn3i

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Junjie Guo - Innovator in Filament Winding Technology

Introduction

Junjie Guo is a prominent inventor based in Taiyuan, China. He has made significant contributions to the field of filament winding technology. His innovative approach has led to the development of a unique filament winding device that enhances manufacturing processes.

Latest Patents

Junjie Guo holds a patent for a filament winding device. This device includes a helical winding device, a circumferential winding device, and a fixing device. The workpiece is clamped through the fixing device, which drives the workpiece to rotate radially and move axially. The helical winding device allows for helical winding, while the circumferential winding device enables circumferential winding.

Career Highlights

Junjie Guo is affiliated with Taiyuan University of Technology, where he continues to advance his research and development efforts. His work has garnered attention for its practical applications in various industries.

Collaborations

Junjie Guo collaborates with notable colleagues, including Runtian Zhao and Jianguo Liang. Their combined expertise contributes to the innovative projects at Taiyuan University of Technology.

Conclusion

Junjie Guo is a key figure in the advancement of filament winding technology, with a focus on practical applications and innovative solutions. His contributions are shaping the future of manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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