Shenzhen, China

Junjie Chen

This inventor holds 1 USPTO granted patent. Top assignee: Vertiv Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Junjie Chen. Retrieved from https://idiyas.com/inventor/junjie-chen-5gdj3yvk

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Junjie Chen and a Space-Efficient Module Snap Device.

Introduction

Junjie Chen is an inventor associated with Shenzhen, China, and Vertiv Corporation. His patent work includes a module snap device designed to secure a module reliably within an apparatus while avoiding the need for additional space.

Latest Patents

The supplied information identifies one patent for Chen: “Module snap device and module.” The invention uses a snap spring strip fitted into a mounting groove, with a snap block that can extend through a mounting hole to secure the module. Pressing the exposed end of the spring strip retracts the snap block. A handle with a pull rod and two rotating arms can lock the spring strip in place when its boss presses against the strip. This arrangement is intended to provide secure, reliable module fixation without occupying additional apparatus space. Chen is credited with 1 patent in the information provided.

Career Highlights

Chen’s listed invention addresses a practical engineering challenge: securing a module while keeping the surrounding apparatus compact. The patent describes coordinated spring and handle mechanisms for engaging and releasing the module.

Collaborations

Chen is associated with Vertiv Corporation. The supplied information does not specify collaborators or further details about his role at the company.

Conclusion

Junjie Chen’s listed patent presents a compact module-fastening mechanism that combines a retractable snap block with a lockable handle to support secure installation and release.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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