Hitachinaka, Japan

Junji Yonemasu

This inventor holds 1 USPTO granted patent. Top assignee: Canon Kabushiki Kaisha. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Junji Yonemasu. Retrieved from https://idiyas.com/inventor/junji-yonemasu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Junji Yonemasu: Innovator in Assembling Technology

Introduction

Junji Yonemasu is a notable inventor based in Hitachinaka, Japan. He has made significant contributions to the field of assembling technology, particularly through his innovative patent that enhances the efficiency of product assembly.

Latest Patents

Yonemasu holds a patent for a "Method of producing assembled product and assembling apparatus." This invention features an assembling apparatus that includes a mold where a second unit opposes a first unit. The apparatus is designed to assemble a product from multiple parts, utilizing various movable portions to facilitate the assembly process. His patent is a testament to his ingenuity and understanding of complex assembly mechanisms. He has 1 patent to his name.

Career Highlights

Junji Yonemasu is associated with Canon Kabushiki Kaisha, a leading company in imaging and printing technology. His work at Canon has allowed him to explore and develop advanced assembling techniques that contribute to the company's innovative product lineup.

Collaborations

Throughout his career, Yonemasu has collaborated with talented individuals such as Junichi Matsumura and Akira Suzuki. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Junji Yonemasu's contributions to assembling technology exemplify the spirit of innovation. His patent and work at Canon reflect his commitment to advancing the field and improving product assembly processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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