Shanghai, China

Junji Kondo

This inventor holds 1 USPTO granted patent. Top assignees: Tamura Corporation, Tamura Corporation of China Limited. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Junji Kondo. Retrieved from https://idiyas.com/inventor/junji-kondo-4mbjigft

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Junji Kondo: Innovator in Substrate Mounting Technology

Introduction

Junji Kondo is a notable inventor based in Shanghai, China. He has made significant contributions to the field of technology, particularly with his innovative designs and patents. His work has been recognized in various industries, showcasing his expertise and dedication to advancing technology.

Latest Patents

Junji Kondo holds a patent for a "Coil for substrate mounting." This invention reflects his commitment to improving the efficiency and effectiveness of substrate mounting processes. With 1 patent to his name, Kondo's work continues to influence the industry.

Career Highlights

Throughout his career, Kondo has worked with prominent companies, including Tamura Corporation and Tamura Corporation of China Limited. His experience in these organizations has allowed him to develop and refine his skills in technology and innovation.

Collaborations

Kondo has collaborated with talented individuals such as Hideto Saeki and Jinwei Lin. These partnerships have contributed to his success and the advancement of his projects.

Conclusion

Junji Kondo is a distinguished inventor whose work in substrate mounting technology has made a lasting impact. His innovative spirit and collaborations with industry professionals continue to drive advancements in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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