This inventor holds 3 USPTO granted patents and 5 published patent applications. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2021-2026.
Company Filing History:
Years Active: 2021-2026
Title: Innovations of Junho Cho in Package-on-Package Technology
Introduction
Junho Cho is a notable inventor based in Chungcheongnam-do, South Korea. He has made significant contributions to the field of electronics, particularly in the development of advanced packaging technologies. With a total of 3 patents to his name, Cho's work is recognized for its innovative approaches to manufacturing processes.
Latest Patents
One of Junho Cho's latest patents is a method of manufacturing a package-on-package device. This method involves a bonding step executed by a bonding apparatus that includes a pressing member and a light source capable of producing a laser beam. The process begins with the provision of a bottom package that consists of a lower substrate, lower solder balls positioned alongside the edge of the lower substrate, and a lower chip located at the center of the lower substrate. The bottom package is then bonded to an interposer substrate that has upper solder balls aligned with the lower solder balls. Subsequently, a top package, which includes an upper substrate and an upper chip, is bonded to the interposer substrate. During this process, while the interposer substrate is placed on the bottom package, the pressing member exerts pressure on the interposer substrate against the bottom package, and the laser beam facilitates the adhesion of the lower solder balls to the upper solder balls.
Career Highlights
Junho Cho is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of electronic packaging, which is crucial for modern electronic devices.
Collaborations
Throughout his career, Cho has collaborated with talented individuals such as Ohchul Kwon and Seungjin Cheon. These collaborations have contributed to the successful development of his patented technologies.
Conclusion
Junho Cho's contributions to the field of package-on-package technology highlight his innovative spirit and dedication to advancing electronic manufacturing processes. His patents reflect a commitment to improving the efficiency and effectiveness of electronic device assembly.