Loveland, CO, United States of America

Jungwon Aldinger

This inventor holds 2 USPTO granted patents. Top assignee: Omnivision Technologies, Inc.. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jungwon Aldinger. Retrieved from https://idiyas.com/inventor/jungwon-aldinger

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2014

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2 patents (USPTO):Explore Patents

Title: Innovations of Jungwon Aldinger

Introduction

Jungwon Aldinger is a notable inventor based in Loveland, Colorado, recognized for his contributions to the field of camera technology. With a total of two patents to his name, Aldinger has made significant strides in the development of integrated die-level camera systems.

Latest Patents

Aldinger's latest patents focus on integrated die-level cameras and methods of manufacturing these advanced systems. The first patent describes an integrated die-level camera system that includes a first die-level camera formed at least partially in a die. Additionally, a second die-level camera is also formed at least partially in the die. Baffling is incorporated to block stray light between the first and second die-level cameras, enhancing the overall performance of the system.

Career Highlights

Aldinger is currently employed at Omnivision Technologies, Inc., where he continues to innovate and develop cutting-edge camera technologies. His work has contributed to advancements in imaging systems that are crucial for various applications.

Collaborations

Some of Aldinger's coworkers include Dennis J Gallagher and Adam Douglas Greengard, who collaborate with him on various projects within the company.

Conclusion

Jungwon Aldinger's work in integrated die-level camera technology showcases his innovative spirit and dedication to advancing imaging systems. His contributions are paving the way for future developments in this exciting field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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