Jungsik Lee

Title: Innovations of Inventor Jungsik Lee

Introduction

Jungsik Lee is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology and camera modules. With a total of nine patents to his name, Lee's work showcases his expertise and innovative spirit.

Latest Patents

One of Lee's latest patents is a semiconductor package that includes a substrate with substrate pads on its top surface. This package features a first upper semiconductor chip with conductive chip pads and bonding wires that connect the substrate pads to the chip. The design includes a first region between the conductive chip pads and the substrate pads, and a second region that enhances the functionality of the bonding wires.

Another notable patent is for a camera module that consists of a PCB and an image sensor. This module is designed with a base that includes a plated portion with an opening for an IR filter. The innovative structure of the module includes a lower spring plate, a spacer, and a lens actuator, all working together to improve image capture quality.

Career Highlights

Jungsik Lee has worked with leading companies in the technology sector, including LG Innotek Co., Ltd. and Samsung Electronics Co., Ltd. His experience in these organizations has allowed him to develop and refine his inventions, contributing to advancements in electronic components.

Collaborations

Lee has collaborated with talented individuals such as Raehyung Do and Seunghyun Go. These partnerships have fostered a creative environment that has led to the development of innovative technologies.

Conclusion

Jungsik Lee's contributions to semiconductor packaging and camera module technology highlight his role as a leading inventor in the field. His patents reflect a commitment to innovation and excellence in technology.