This inventor holds 1 USPTO granted patent. Top assignee: University of Pittsburgh. Active years: 2010.
Company Filing History:
Years Active: 2010
Title: Innovations by Jungfeng Mei in Electronic Device Fabrication.
Introduction
Jungfeng Mei is an accomplished inventor based in New Stanton, PA (US). He has made significant contributions to the field of electronic device fabrication, particularly through his innovative methods involving electrically conductive polymers.
Latest Patents
Jungfeng Mei holds a patent for a "Method of making an electronic device using an electrically conductive polymer, and associated products." This patent describes methods for fabricating electronic devices, such as RFID tags, by depositing an electrically conductive polymer onto a substrate. The polymer is electrically connected to components like IC chips or diodes, which can be placed on the substrate before or after the polymer deposition. The curing process of the polymer is essential, and various deposition techniques are outlined, including mask application, screen printing, and inkjet printing.
Career Highlights
Jungfeng Mei is affiliated with the University of Pittsburgh, where he continues to advance research in electronic device technology. His work has garnered attention for its practical applications in modern electronics.
Collaborations
Some of his notable coworkers include Marlin H Mickle and James T Cain, who have contributed to the research and development of innovative electronic solutions alongside him.
Conclusion
Jungfeng Mei's contributions to the field of electronic device fabrication highlight the importance of innovative methods in advancing technology. His work continues to influence the development of new electronic products and applications.