Anyang-si, South Korea

Jung-Soo Byun


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Innovations of Jung-Soo Byun

Jung-Soo Byun is a notable inventor based in Anyang-si, South Korea. He has made significant contributions to the field of electronics, particularly in the development of printed circuit boards. His innovative work has led to the creation of a unique electronic component embedded printed circuit board.

Latest Patents

Jung-Soo Byun holds a patent for an electronic component embedded printed circuit board. This invention discloses a printed circuit board in which an electronic component is embedded in a core board. The electronic component includes a silicon layer and a passivation layer, which is formed on one surface of the silicon layer. Notably, the center line of the silicon layer and the center line of the core board are aligned on the same line. This innovation enhances the functionality and efficiency of electronic devices.

Career Highlights

Jung-Soo Byun is currently employed at Samsung Electro-Mechanics Co., Ltd. His work at this leading company in the electronics sector has allowed him to further develop his skills and contribute to groundbreaking technologies. His dedication to innovation has positioned him as a key figure in his field.

Collaborations

Jung-Soo Byun has collaborated with talented coworkers, including Yul-Kyo Chung and Hwa-sun Park. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of advanced technologies.

Conclusion

Jung-Soo Byun's contributions to the field of electronics, particularly through his patent for an electronic component embedded printed circuit board, highlight his innovative spirit and dedication to advancing technology. His work at Samsung Electro-Mechanics Co., Ltd. and collaborations with esteemed colleagues further emphasize his impact in the industry.

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