The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2013

Filed:

Oct. 29, 2010
Applicants:

Jung-soo Byun, Anyang-si, KR;

Yul-kyo Chung, Yongin-si, KR;

Hwa-sun Park, Suwon-si, KR;

Kyung-min Lee, Daejeon, KR;

Mike Kim, Daejeon, KR;

Doo-hwan Lee, Euijungboo-si, KR;

Inventors:

Jung-Soo Byun, Anyang-si, KR;

Yul-Kyo Chung, Yongin-si, KR;

Hwa-Sun Park, Suwon-si, KR;

Kyung-Min Lee, Daejeon, KR;

Mike Kim, Daejeon, KR;

Doo-hwan Lee, Euijungboo-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic component embedded printed circuit board is disclosed. In accordance with an embodiment of the present invention, the electronic component embedded printed circuit board is a printed circuit board in which an electronic component is embedded in a core board, and the electronic component includes a silicon layer and a passivation layer, which is formed on one surface of the silicon layer. Here, a center line of the silicon layer and a center line of the core board are placed on a same line.


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