Cary, NC, United States of America

Jung Pil Kim


Average Co-Inventor Count = 8.0

ph-index = 1


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: Innovator Jung Pil Kim: Pioneering Multi-Chip Package Technology

Introduction: Jung Pil Kim, based in Cary, NC, is an accomplished inventor recognized for his significant contributions to the field of semiconductor technology. With one patented invention to his name, he has made strides in enhancing the efficiency and functionality of multi-chip packages, critical components in modern electronics.

Latest Patents: Jung Pil Kim holds a patent for a "Multi-chip package with interconnected stacked chips." This innovative design features at least three chips, each equipped with a top and bottom surface. The multi-chip package integrates a package substrate that interfaces seamlessly with printed circuit boards (PCBs). Each chip is housed within an encapsulating material, which provides crucial protection and structural integrity. The design allows the bottom surface of the first chip to be attached to the package substrate, while its top surface contains a plurality of landing pads that facilitate electrical and mechanical connections with the second chip. Moreover, the second chip also includes landing pads that ensure effective interfaces with both the first and third chips, fostering improved communication and performance within electronic devices.

Career Highlights: Jung Pil Kim currently works at Qimonda AG, an organization renowned for its advancements in memory and semiconductor technologies. His role at the company underscores his commitment to driving innovation in the electronics industry.

Collaborations: In his professional journey, Jung Pil Kim collaborates with talented individuals including Jong Hoon Oh and Klaus Hummler. Together, they share insights and expertise, enhancing the collaborative spirit vital for technological advancements.

Conclusion: Jung Pil Kim stands out as a notable inventor in the semiconductor arena, with his innovative multi-chip package design reflecting his vision for future technology. As he continues to work at Qimonda AG, his efforts pave the way for more efficient and capable electronic devices, ensuring that he remains an influential figure in the realm of inventions and innovations.

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