Taipei, Taiwan

Jung-Hsuan Wu

This inventor holds 1 USPTO granted patent. Top assignee: Compal Electronics, Inc.. Active years: 2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jung-Hsuan Wu. Retrieved from https://idiyas.com/inventor/jung-hsuan-wu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2007

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1 patent (USPTO):Explore Patents

Title: Jung-Hsuan Wu: Innovator in Flexible Flat Cable Technology

Introduction

Jung-Hsuan Wu is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of flexible flat cable technology. His innovative approach has led to the development of a unique patent that addresses common issues in cable connectivity.

Latest Patents

Jung-Hsuan Wu holds a patent for a "Flexible flat cable with a positioning structure and connector using the same." This invention features a flexible flat cable equipped with a positioning structure located near the signal contact part. The corresponding connector includes a positioning structure on a movable lid, ensuring that the flexible flat cable can be inserted straight without slanting. This design effectively mitigates the risk of poor connections between the cable and the connector.

Career Highlights

Wu is currently employed at Compal Electronics, Inc., where he continues to innovate and develop new technologies. His work focuses on enhancing the functionality and reliability of electronic components, particularly in the realm of flexible cables.

Collaborations

Jung-Hsuan Wu collaborates with Chia-Ying Chen, contributing to the advancement of their projects and innovations in the field.

Conclusion

Jung-Hsuan Wu's contributions to flexible flat cable technology exemplify his commitment to innovation and problem-solving in electronics. His patent reflects a significant advancement in ensuring reliable connections in electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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