Jung-Chan Chang

Title: Jung-Chan Chang: Innovator in Interconnect Structures

Introduction

Jung-Chan Chang is a notable inventor based in Xinshi, Taiwan. He has made significant contributions to the field of interconnect structures, showcasing his innovative spirit through his patented inventions.

Latest Patents

Chang holds a patent for an interconnect structure that includes a substrate, a pair of interconnect pads, and a pair of transmission lines. The substrate is designed with at least one layer, where each layer features a first surface plane and a second surface plane. The interconnect pads are formed on the first surface plane of the first layer, while the transmission lines are also situated on this plane. Notably, the transmission lines incorporate a Y-type close trace portion that connects to the interconnect pads. Additionally, the first surface plane of the layer is equipped with a via hole that extends to the second surface plane, which serves as either a power plane or a ground plane. This innovative design enhances the functionality and efficiency of interconnect structures.

Career Highlights

Jung-Chan Chang is currently employed at Himax Media Solutions, Inc., where he continues to develop and refine his inventions. His work at this company has allowed him to collaborate with other talented professionals in the field, further advancing his expertise and contributions to technology.

Collaborations

One of his notable coworkers is Ding-Bing Lin, with whom he has likely shared insights and ideas that contribute to their mutual success in the industry.

Conclusion

Jung-Chan Chang's innovative work in interconnect structures exemplifies the impact of dedicated inventors in technology. His patent reflects a commitment to advancing the field, and his career at Himax Media Solutions, Inc. positions him as a key player in the industry.