Jun-young Oh

Title: Jun-young Oh: Innovator in Semiconductor Technology

Introduction

Jun-young Oh is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative methods for manufacturing semiconductor packages, which are essential components in modern electronic devices.

Latest Patents

One of Jun-young Oh's latest patents involves a semiconductor package and method of manufacturing the same. This semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the semiconductor chip. The molding member is designed with fillers, where each filler consists of a core and a coating layer. The core is made from a non-electromagnetic material, while the coating layer is composed of an electromagnetic material. Additionally, the molding member features regions that have different distributions of the fillers, enhancing the performance and reliability of the semiconductor package.

Career Highlights

Jun-young Oh is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His role at Samsung has allowed him to work on cutting-edge technologies and contribute to the advancement of semiconductor solutions. His expertise in this area has positioned him as a valuable asset to the company.

Collaborations

Throughout his career, Jun-young Oh has collaborated with notable colleagues, including Hyun-ki Kim and Sang-soo Kim. These collaborations have fostered innovation and have led to the development of advanced semiconductor technologies.

Conclusion

Jun-young Oh's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the field. His advancements in semiconductor packaging are paving the way for future developments in electronic devices.