Company Filing History:
Years Active: 2012-2014
Title: Jun-Yong Wang: Innovator in Packaging Technology
Introduction
Jun-Yong Wang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of packaging technology, holding a total of 2 patents. His work focuses on innovative methods and structures that enhance the efficiency and effectiveness of packaging in the semiconductor industry.
Latest Patents
Wang's latest patents include a novel packaging structure and a method for manufacturing this packaging structure. The packaging structure comprises a substrate film, a plurality of chips, a compound resin layer, and a support layer. The substrate film is designed with circuits that have multiple terminals exposed from a solder mask. Each chip features several pads, under bump metals (UBMs) formed on the pads, and composite bumps placed onto the UBMs. These chips are bonded onto the substrate film to create the first tape. The second tape consists of the support layer and the compound resin layer formed on it. Both tapes are in reel form and are expanded towards a pair of rollers, which are heated and pressurized to encapsulate the chips effectively.
Career Highlights
Jun-Yong Wang is currently employed at Chipmos Technologies Inc., where he continues to innovate in the field of semiconductor packaging. His expertise and dedication to advancing technology have made him a valuable asset to his company.
Collaborations
Wang collaborates with Geng-Shin Shen, a fellow innovator in the industry. Their combined efforts contribute to the development of cutting-edge packaging solutions.
Conclusion
Jun-Yong Wang's contributions to packaging technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in semiconductor packaging, positioning him as a key figure in this vital industry.